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Gate dielectrics prepared by double nitridation in NO and N2O

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Abstract.

Oxynitrides prepared by double nitridation in nitric oxide (NO) and nitrous oxide (N2O) are compared to the one with a single NO nitridation. Based on various hot-carrier stresses, harder oxide/Si interface, less charge trapping and generation of electron/hole traps in oxide, and larger charge-to-breakdown are observed for the doubly-nitrided gate dielectrics than the singly-nitrided one. By analyzing the nitrogen profiles in these oxynitrides, it is revealed that the involved mechanisms lie in the smaller distance of peak nitrogen concentration from the oxide/Si interface and the higher nitrogen content near the oxide/Si interface in the doubly-nitrided oxynitrides.

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Received: 7 June 1999 / Accepted: 29 July 1999 / Published online: 3 November 1999

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Xu, J., Lai, P. & Cheng, Y. Gate dielectrics prepared by double nitridation in NO and N2O . Appl Phys A 70, 101–105 (2000). https://doi.org/10.1007/s003390050020

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  • DOI: https://doi.org/10.1007/s003390050020

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