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Wettability in ZrO2-Ni and ZrO2-Cu bonding

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, 30043, Hsinchu, Taiwan

    J. G. Duh & W. S. Chien

  2. Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan

    B. S. Chiou

Authors
  1. J. G. Duh
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  2. W. S. Chien
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  3. B. S. Chiou
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Duh, J.G., Chien, W.S. & Chiou, B.S. Wettability in ZrO2-Ni and ZrO2-Cu bonding. J Mater Sci Lett 8, 405–408 (1989). https://doi.org/10.1007/BF00720688

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  • DOI: https://doi.org/10.1007/BF00720688

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