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Enhancement of copper adhesion on alumina induced by ion-beam mixing

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Journal of Materials Science Letters

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Fuchs, G., Abonneau, E., Treilleux, M. et al. Enhancement of copper adhesion on alumina induced by ion-beam mixing. J Mater Sci Lett 9, 97–99 (1990). https://doi.org/10.1007/BF00722883

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  • DOI: https://doi.org/10.1007/BF00722883

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