Method for Paste Selection and Process Optimisation for Fine‐pitch SMT
Abstract
This paper outlines a methodology of paste selection for fine‐pitch SMT using a sequential investigation process including Design of Experiments (DoE) techniques. Several factors including SMT machine parameters as well as environmental conditions were investigated as to their effect on the soldering process. Materials and processes were selected for optimum performance. This resulted in the development of a robust fine‐pitch SMT process for the Hewlett Packard (hp) Medical Equipment Group in Andover, Massachusetts.
Keywords
Citation
Gagne, D., Quaglia, M. and Shina, S.G. (1996), "Method for Paste Selection and Process Optimisation for Fine‐pitch SMT", Soldering & Surface Mount Technology, Vol. 8 No. 3, pp. 9-11. https://doi.org/10.1108/09540919610777690
Publisher
:MCB UP Ltd
Copyright © 1996, MCB UP Limited