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Effect of thiourea on the electrodeposition of copper powder

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Soviet Powder Metallurgy and Metal Ceramics Aims and scope

Conclusions

  1. 1.

    It is shown that TU may be utilized for regulating the structure and particle size of copper powder electrodeposits.

  2. 2.

    Depending on its concentration, TU may have a depolarizing or a passivating action. At gxu 4 · 10−4 mole/liter, a limiting adsorption current is generated.

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Translated from Poroshkovaya Metallurgiya, No. 10 (118), pp. 1–5, October, 1972.

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Gurevich, L.I., Pomosov, A.V. Effect of thiourea on the electrodeposition of copper powder. Powder Metall Met Ceram 11, 773–776 (1972). https://doi.org/10.1007/BF00844698

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  • DOI: https://doi.org/10.1007/BF00844698

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