Conclusions
-
1.
It is shown that TU may be utilized for regulating the structure and particle size of copper powder electrodeposits.
-
2.
Depending on its concentration, TU may have a depolarizing or a passivating action. At gxu 4 · 10−4 mole/liter, a limiting adsorption current is generated.
Similar content being viewed by others
Literature cited
A. V. Pomosov and A. I. Levin, Transactions of a Conference on the Effects of Surfactants upon the Electrodeposition of Metals [in Russian], Vilnius (1957), p. 227.
L. I. Gurevich and A. V. Pomosov, Poroshkovaya Met., Nos. 1 and 11 (1969).
K. Watanabe and T. Hanryu, Japan. Pat. No. 1911, May 30, 1952.
F. Novel and B. Ostraw, Plating, No. 8, 12 (1954).
S. Ockada, S. Magari, and K. Katsui, J. Electrochem. Soc., No. 10, 103 (1956).
L. I. Antropov and Ya. S. Popov, Zh. Prikl. Khim.,27, 55 (1954).
A. T. Vagramyan and Z. A. Solov'eva, Methods of Investigation of Metal Electrodeposition [in Russian], Izd-vo AN SSSR, Moscow (1955).
T. A. Kryukova and V. I. Melik-Gaikazan, Transactions of a Conference on Electrochemistry [in Russian], Moscow (1950), p. 315.
M. A. Loshkarev et al., Fundamental Problems in Modern Theoretical Electrochemistry [in Russian], Moscow (1965), p. 380.
S. Eaton, R. Fabian, and E. Newton, Metal Finishing,50, No. 12, 63 (1952).
J. Llopis, J. Gamboa, and L. Arismendi, Proceedings of the Ninth Meeting of the International Committee on Electrochemistry, Paris (1957).
D. N. Gritsan et al., Zashchita Metal., No. 5, 593 (1968).
Author information
Authors and Affiliations
Additional information
Translated from Poroshkovaya Metallurgiya, No. 10 (118), pp. 1–5, October, 1972.
Rights and permissions
About this article
Cite this article
Gurevich, L.I., Pomosov, A.V. Effect of thiourea on the electrodeposition of copper powder. Powder Metall Met Ceram 11, 773–776 (1972). https://doi.org/10.1007/BF00844698
Received:
Issue Date:
DOI: https://doi.org/10.1007/BF00844698