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The electrodeposition of copper-silver and copper-nickel alloy powders from aqueous ammoniacal solutions

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Abstract

The electrodeposition of copper-silver and copper-nickel powders from aqueous ammoniacal solutions at a continuously scraped rotating cylinder cathode is described. Ag-Cu powders can be prepared under these conditions, but the individual particles are inhomogeneous and the extent of this inhomogeneity is examined. Surface areas (from BET) and particle size distributions are reported, and the morphology is considered. Cu-Ni powders deposited under these conditions are heavily contaminated with oxide/ hydroxides and this is attributed to an increase in near-cathode pH.

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References

  1. R. Calosaru, ‘Electrodeposition of Metal Powders’, Elsevier, Amsterdam (1979).

    Google Scholar 

  2. R. Walker,Chem. Ind. 5 April (1980) 260.

  3. D. W. Cruickshanks-Boyd, A. T. Kuhn and F. Walsh,Trans. Inst. Metal Finish. 59 (1981) 68.

    Google Scholar 

  4. A. T. Kuhn, P. Neufeld and D. W. Cruickshanks-Boyd,ibid. 61 (1983) 30.

    Google Scholar 

  5. P. Neufeld, A. T. Kuhn and H. A. Skinner,Inst. Chem. Eng. Symp. Proc. 69 (1983) 1.

    Google Scholar 

  6. R. Walker,Corrosion-NACE 32 (1976) 339.

    Google Scholar 

  7. ‘Copper and Copper Alloy filled Gel-coats for anti-fouling’ published by the Copper Development Association in conjunction with Scott Bader Ltd.

  8. A. Brenner, ‘Electrodeposition of Alloys’ Vol. 1, Academic Press, London (1963).

    Google Scholar 

  9. M. Pushpavanam and B. A. Shenoi, ‘Galvano-Organo’ Pt. I, May (1977) 557.

  10. Idem, ‘Galvano-Organo’ Pt. II, Oct. (1977) 919.

  11. G. K. Burkat,Zh. Prikl. Khim. 40 (1967) 2497.

    Google Scholar 

  12. Idem, ibid. 50 (1977) 1645.

    Google Scholar 

  13. P. L. Ahuja and T. Banerjee,Tech. J. (India) 4 (1962) 15.

    Google Scholar 

  14. Idem, Mem. Sci. Rev. Metall. 58 (1961) 309.

    Google Scholar 

  15. O. V. Moiseeva, P. M. Vyacheslov and G. K. Burkat,Sov. Electrochem. 17 (1981) 388.

    Google Scholar 

  16. K. Aotani,Nippon Kinz. Gakkaishi 15 (1951) 52.

    Google Scholar 

  17. East German Patent 37 249 (1965) (seeChem. Abs. 63 7909).

  18. USSR Patent274 602 (Chem. Abs. 74 27 533).

  19. West German Patent 2 704 691 (Chem. Abs. 87 159 174).

  20. W. Gruhl and H. Kramer,Metall. 12 (1958) 707.

    Google Scholar 

  21. J. M. Polukarov, K. M. Gorbunova and W. W. Bondar,Electrochim. Acta 1 (1959) 358.

    Google Scholar 

  22. J. M. Polukarov and V. V. Grinina,Russ. J. Phys. Chem. 39 (1965) 622.

    Google Scholar 

  23. V. S. Galinker, P. V. Savenko and O. K. Kundra,Zaschisa Metall. 6 (1970) 81.

    Google Scholar 

  24. Y. N. Sadana, A. K. Deshpande and R. N. Gedye,Surf. Technol. 17 (1982) 111.

    Google Scholar 

  25. M. Kurachi and M. Suyama,Denki Kagaku 41 (1973) 26.

    Google Scholar 

  26. Y. N. Sadana and T. K. Venkatachalam,Metal Finish. 77 (1979) 15.

    Google Scholar 

  27. V. P. Raj and S. L. N. Acharyyuku,Trans. Indian Inst. Met. June (1970) 51.

  28. A. T. Kuhn,Oberflache-Surface 23 (1982) 279.

    Google Scholar 

  29. A. T. Kuhn and C. Y. Chan,J. Appl. Electrochem. 13 (1983) 189.

    Google Scholar 

  30. E. Pelaez and H. Bartelt,Rev. CENIC Cienc. Fis. 11 (1980) 55.

    Google Scholar 

  31. I. V. Gamali and A. I. Samson,Electrokhimya 17 (1981) 1533.

    Google Scholar 

  32. E. Kowalska,Zesz. Nauk. Politech. Slask. Chem. 39 (1967) 173.

    Google Scholar 

  33. Z. Goerlich,Zesz. Nauk. Univ. Jagiellon. Pr. Chem. 18 (1973) 295.

    Google Scholar 

  34. H. Bartelt and C. Nunez,Rev. CENIC Cienc. Fis. 10 (1979) 193.

    Google Scholar 

  35. Idem, ibid. 10 (1979) 205.

    Google Scholar 

  36. G. A. Emel'yanenko and G. G. Simulin,Elektrokhimiya 4 (1968) 187.

    Google Scholar 

  37. R. Kvaratskheliya,Izv. Akad. Nauk. Gruz. SSR Ser. Khim. 2 (1976) 140 (seeChem. Abstr. 86 23 386).

    Google Scholar 

  38. R. Barnard, J. A. Lee and A. D. Sperrin,J. Appl. Electrochem. 4 (1974) 143.

    Google Scholar 

  39. D. Pletcher and Z. Pooradhedi,Electrochim. Acta 24 (1979) 1253.

    Google Scholar 

  40. T. A. Pisarenko and E. N. Mirolyubov,Sov. Electrochem. 10 (1974) 100.

    Google Scholar 

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Kuhn, A.T., Neufeld, P. & Young, K. The electrodeposition of copper-silver and copper-nickel alloy powders from aqueous ammoniacal solutions. J Appl Electrochem 14, 605–613 (1984). https://doi.org/10.1007/BF00626304

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  • DOI: https://doi.org/10.1007/BF00626304

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