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Birchall, J.D., Alford, N.M. & Kendall, K. Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. J Mater Sci Lett 6, 1456–1458 (1987). https://doi.org/10.1007/BF01689321
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DOI: https://doi.org/10.1007/BF01689321