Skip to main content
Log in

Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact

  • Published:
Journal of Materials Science Letters

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

References

  1. J. D. BIRCHALL,Brit. Ceram. Trans. J. 83 (1984) 158.

    Google Scholar 

  2. J. E. CASSIDY,Bull. Am. Ceram. Soc. 59 (1980) 727.

    Google Scholar 

  3. J. D. BIRCHALL and J. E. CASSIDY, US Pat. 1 322 725 (1973).

  4. Idem. US Pat. 3 950 177 (1976).

  5. Idem. US Pat. 3 870 737 (1975).

  6. J. E. CASSIDY, J. A. J. JARVIS and R. ROTHON,J.C.S. Dalton Trans. (1975) 1497.

  7. K. KENDALL, N. McN. ALFORD and J. D. BIRCHALL,Spec. Ceram. 8 (1986) 255.

    Google Scholar 

  8. Idem, Nature 325 (1987) 794.

  9. Idem, Proc. R. Soc. Lond., in press.

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Birchall, J.D., Alford, N.M. & Kendall, K. Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. J Mater Sci Lett 6, 1456–1458 (1987). https://doi.org/10.1007/BF01689321

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF01689321

Keywords

Navigation