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Co-curing studies of ethynyl terminated oligoimide and (methyl) nadicimide resins

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Abstract

The paper describes the co-curing studies of ethynyl and ethenyl end-capped imide resins. The effect of composition and chemical structure of ethenyl end-capped resins (nadicimides) on thermal behavior of ethynyl end-capped resins was evaluated using DSC and thermogravimetric analysis. An increase in char yield was observed on co-curing of few resin formulations. A mechanism has been proposed to account for this observation.

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Authors and Affiliations

  1. Defence Materials & Stores Research & Development Establishment P. O. DMSRDE, G. T. Road, 208 013, Kanpur

    Sarfaraz Alam, L. D. Kandpal & I. K. Varma

  2. Centre for Polymer Science & Engineering, Indian Institute of Technology, Delhi, Hauz Khas, 110 016, New Delhi, India

    I. K. Varma

Authors
  1. Sarfaraz Alam
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  2. L. D. Kandpal
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  3. I. K. Varma
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Alam, S., Kandpal, L.D. & Varma, I.K. Co-curing studies of ethynyl terminated oligoimide and (methyl) nadicimide resins. Journal of Thermal Analysis 47, 685–695 (1996). https://doi.org/10.1007/BF01981804

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  • DOI: https://doi.org/10.1007/BF01981804

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