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The copolymer of methyl methacrylate and methacrylic acid as a sensitive resist for deep-etch X-ray lithography

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Abstract

The copolymer of methyl methacrylate and methacrylic acid was developed as a new sensitive resist for the LIGA (Lithographie, Galvanoformung, Abformtechnik) process. The resist exposures were carried out at the LIGA beamline of a superconducting compact light source NIJI-III. The absorbed energy density required to remove the entire exposed resist and produce a defect-free microstructure was between 0.4 and 7 kJ/cm3 (4 and 20 kJ/cm3 for PMMA). The sensitivity and patterning depth of the copolymer were 10 times and 3.5 times, respectively, those of poly methyl methacrylate (PMMA) assuming that both resists were exposed to synchrotron radiation (SR) of the same wavelength. Moreover, the copolymer showed high contrast and process stability.

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References

  • Ehrfeld W.;Bley P.;Gotz F.;Mohr J.;Munchmeyer D.;Schelb W. (1988) Progress in deep-etch synchrotron radiation lithography. J. Vac. Sci. Technol. B6, 178–182

    Article  Google Scholar 

  • Ehrfeld W.;Munchmeyer D. (1991) Three dimensional microfabrication using synchrotron radiation, Nucl. Instr. and Meth. in. Phys. Res. A303, 523–531

    Article  Google Scholar 

  • Haller I.;Feder R.;Hatzakis M.;Spiller E. (1979) Copolymer of methyl methacrylate and methacrylic acid and their metal salts as radiation sensitive resists. J. Electrochem. Soc. 126(1), 154–161

    Article  Google Scholar 

  • Hirata Y.; Okuyama H.; Ogino S.; Numazawa T.; Takada H. (1995) Piezoelectric composites for micro-ultrasonic transducers realized-with deep-etch X-ray lithography. Proc. IEEE Micro Electro Mechanical Systems Workshop. 191–196

  • Mohr J.;Ehrfeld W.;Munchmeyer D. (1988) Requirement on resist layers in deep-etch synchrotron radiation lithography. J. Vac. Sci. Technol. B6 (6), 2264–2267

    Article  Google Scholar 

  • Muncymeyer D.;Langen J. (1992) Manufacture of three dimensional microdevices using synchrotron radiation, Rev. Sci. Instrum. 63 (1), 713–721

    Article  Google Scholar 

  • Schnabel W. (1981) Polymer degradation, Hauser Verlag, Berlin

    Google Scholar 

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Authors and Affiliations

  1. Harima Research Laboratories, Sumitomo Electric Industries, Ltd, 1431-12 Harima Science Garden City, 678-12, Kamigori, Hyogo, Japan

    T. Numazawa, Y. Hirata & H. Takada

Authors
  1. T. Numazawa
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  2. Y. Hirata
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  3. H. Takada
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Additional information

This work was performed under the management of the Micromachine Center as part of the Research and Development of Micromachine Technology supported by NEDO (New Energy and Industrial Technology Development Organization).

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Numazawa, T., Hirata, Y. & Takada, H. The copolymer of methyl methacrylate and methacrylic acid as a sensitive resist for deep-etch X-ray lithography. Microsystem Technologies 2, 46–49 (1996). https://doi.org/10.1007/BF02447749

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  • DOI: https://doi.org/10.1007/BF02447749

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