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Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist

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Abstract

 An innovative method for fabrication and rapid prototyping of high-aspect ratio micromechanical components in photoresist is discussed. The photoresist is an epoxy-negative-tone resist, called SU-8, which can be structured to more than 2 mm in thickness by UV exposure. Small gears of 530 μm in diameter and 200 μm in thickness have been realized in this photoplastic and their functionality has been demonstrated. In addition a process called MIMOTECTM (MIcroMOlds TEChnology) has been established for the fabrication of metallic micromolds. MIMOTECTM is based on the use of the SU-8 spun on high thicknesses and electrodeposition of nickel. Thermoplastic microcomponents have been injected and mounted in watches.

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Authors and Affiliations

  1. Swiss Federal Institute of Technology, DMT-IMS CH-1015 Lausanne, Switzerland, , , , , , CH

    H. Lorenz & P. Renaud

  2. IBM Research Division Zurich Research Laboratory CH-8803 Rueschlikon, Switzerland, , , , , , CH

    M. Despont & P. Vettiger

Authors
  1. H. Lorenz
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  2. M. Despont
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  3. P. Vettiger
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  4. P. Renaud
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Received: 25 August 1997/Accepted: 23 October 1997

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Lorenz, H., Despont, M., Vettiger, P. et al. Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist. Microsystem Technologies 4, 143–146 (1998). https://doi.org/10.1007/s005420050118

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  • DOI: https://doi.org/10.1007/s005420050118

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