A 10 MHz micropower CMOS front end for direct readout of pixel detectors

https://doi.org/10.1016/0168-9002(90)90355-AGet rights and content

Abstract

In the framework of the CERN-LAA project for detector R and D, a micropower circuit of 200 μm×200μm with a current amplifier, a latched comparator and a digital memory element has been tested electrically and operated in connection with linear silicon detector arrays. The experimental direct-readout (DRO) chip comprises a matrix of 9×12 circuit cells and has been manufactured in a 3 μm CMOS technology. Particles and X-ray photons below 22 keV were detected, and thresholds can be set between 2000 and 20 000 e. The noise is less than 4 keV FWHM or 500 e rms and the power dissipation per pixel element is 30 μW. The chip can be coupled to a detector matrix using bump bonding.

References (4)

  • E.H.M. Heijne et al.

    Nucl. Instr. and Meth.

    (1988)
  • A.M.E. Hoeberechts

    Nucl. Instr. and Meth.

    (1989)
There are more references available in the full text version of this article.

Cited by (29)

  • Particle physics experiments: From photography to integrated circuits

    2023, Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
  • History and future of radiation imaging with single quantum processing pixel detectors

    2021, Radiation Measurements
    Citation Excerpt :

    This readout chip was manufactured in the 3 μm SACMOS technology of Faselec AG in Zurich, tested in the summer 1989 and results were planned to be reported at the 1989 IEEE Nuclear Science Symposium in San Francisco. However, the Loma Prieta earthquake on 17 October led to cancellation of the Symposium, and the report was submitted to Nuclear Instruments and Methods (Campbell et al., 1990). Measurements had been made with silicon sensors connected to a few pixels, by wirebonding and not yet by bumps, because the external connections on the edge of this chip prevented placement of a matching sensor matrix.

  • Silicon strip and pixel detectors for particle physics experiments

    2019, Physics Reports
    Citation Excerpt :

    The concept was realized [18] and applied [19] to tracking in the WA-94 (Omega) experiment at CERN and its successors WA-97 and NA-57, where the density of tracks produced in heavy ion collisions made improved segmentation especially urgent. This development began to shift the principal technology effort toward challenges in readout [20,21]. The rapid development of miniaturized electronics for VLSI accelerated detector evolution in this period, see for example the CAMEX [22] and Microplex [23] readout designs.

  • Experimental characterization of a 10 μw 55 μm-pitch FPN-compensated CMOS digital pixel sensor for X-ray imagers

    2014, Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
    Citation Excerpt :

    In this figure, Isens and Vcom stand for the detector readout current and high-voltage biasing, respectively. Regarding the readout circuitry, the reading method can be classified into two widely studied categories: charge-integration [3–6], and photon-counting [7–10]. Most charge-integration approaches present limited functionality, either requiring external analog references or lacking test capability or in-pixel A/D conversion.

  • Semiconductor micropattern pixel detectors: A review of the beginnings

    2001, Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
View all citing articles on Scopus

Now with Smart Silicon Systems, Lausanne, Switzerland.

∗∗

Also with Centre Suisse d'Electronique et de Microtechnique, Neuchâtel, Switzerland.

View full text