A 10 MHz micropower CMOS front end for direct readout of pixel detectors
References (4)
- et al.
Nucl. Instr. and Meth.
(1988) Nucl. Instr. and Meth.
(1989)
Cited by (29)
Particle physics experiments: From photography to integrated circuits
2023, Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated EquipmentHistory and future of radiation imaging with single quantum processing pixel detectors
2021, Radiation MeasurementsCitation Excerpt :This readout chip was manufactured in the 3 μm SACMOS technology of Faselec AG in Zurich, tested in the summer 1989 and results were planned to be reported at the 1989 IEEE Nuclear Science Symposium in San Francisco. However, the Loma Prieta earthquake on 17 October led to cancellation of the Symposium, and the report was submitted to Nuclear Instruments and Methods (Campbell et al., 1990). Measurements had been made with silicon sensors connected to a few pixels, by wirebonding and not yet by bumps, because the external connections on the edge of this chip prevented placement of a matching sensor matrix.
Silicon strip and pixel detectors for particle physics experiments
2019, Physics ReportsCitation Excerpt :The concept was realized [18] and applied [19] to tracking in the WA-94 (Omega) experiment at CERN and its successors WA-97 and NA-57, where the density of tracks produced in heavy ion collisions made improved segmentation especially urgent. This development began to shift the principal technology effort toward challenges in readout [20,21]. The rapid development of miniaturized electronics for VLSI accelerated detector evolution in this period, see for example the CAMEX [22] and Microplex [23] readout designs.
Experimental characterization of a 10 μw 55 μm-pitch FPN-compensated CMOS digital pixel sensor for X-ray imagers
2014, Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated EquipmentCitation Excerpt :In this figure, Isens and Vcom stand for the detector readout current and high-voltage biasing, respectively. Regarding the readout circuitry, the reading method can be classified into two widely studied categories: charge-integration [3–6], and photon-counting [7–10]. Most charge-integration approaches present limited functionality, either requiring external analog references or lacking test capability or in-pixel A/D conversion.
Semiconductor micropattern pixel detectors: A review of the beginnings
2001, Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
- ∗
Now with Smart Silicon Systems, Lausanne, Switzerland.
- ∗∗
Also with Centre Suisse d'Electronique et de Microtechnique, Neuchâtel, Switzerland.