Air cooling of front-end electronics for silicon detectors in a collider experiment

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Abstract

We have investigated the feasibility of using room temperature air to cool front-end electronics for silicon microstrip and pad detectors in a collider experiment. Advantages of air cooling include minimal material in the path of the particles and no potential of coolant spills in the silicon region. A prototype cooling system was tested with heat provided by flat resistive heaters. Heat loads from 1 to 27 mW/channel were studied, making the results applicable to various silicon detector systems. The measurements are compared to cooling system performance predictions. A set of simple equations has been identified and tested which reliably describe the lab setup.

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