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Current-time behaviour for copper electrodeposition. I. Theoretical analysis based on a surface diffusion model

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Abstract

The form of the current-time transients for copper electrodeposition from copper sulphate solutions have been calculated based on a surface diffusion model. The transient was greatly affected by whether the ad-species diffusing across the surface was ad-atom Cu0 or ad-ion Cu+, and by the surface coverage by the ad-species. The results imply that it is possible to experimentally test the applicability of the surface diffusion model to copper electrodeposition, to identify the ad-species (Cu0 or Cu+), to estimate the surface coverage and to calculate the parameters related to surface diffusion,D/l 2 andi 0/c 0.

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Author notes

  1. Y. Ogata

    Present address: Department of Synthetic Chemistry, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, 466, Nagoya, Japan

Authors and Affiliations

  1. Department of Industrial Chemistry, Kyoto University, Kyoto, Japan

    Y. Ogata, K. Yamakawa & S. Yoshizawa

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  1. Y. Ogata
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  2. K. Yamakawa
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  3. S. Yoshizawa
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Ogata, Y., Yamakawa, K. & Yoshizawa, S. Current-time behaviour for copper electrodeposition. I. Theoretical analysis based on a surface diffusion model. J Appl Electrochem 12, 439–447 (1982). https://doi.org/10.1007/BF00610486

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  • DOI: https://doi.org/10.1007/BF00610486

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