Abstract
The paper describes the co-curing studies of ethynyl and ethenyl end-capped imide resins. The effect of composition and chemical structure of ethenyl end-capped resins (nadicimides) on thermal behavior of ethynyl end-capped resins was evaluated using DSC and thermogravimetric analysis. An increase in char yield was observed on co-curing of few resin formulations. A mechanism has been proposed to account for this observation.
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Alam, S., Kandpal, L.D. & Varma, I.K. Co-curing studies of ethynyl terminated oligoimide and (methyl) nadicimide resins. Journal of Thermal Analysis 47, 685–695 (1996). https://doi.org/10.1007/BF01981804
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DOI: https://doi.org/10.1007/BF01981804