Abstract
In this work we describe the results of Rutherford backscattering spectrometry, sheet resistivity measurements, X-ray diffractometry and conversion electron Mössbauer spectroscopy performed on thin film Fe-Al bilayered samples submitted to high vacuum furnace annealing. Isothermal anneals were performed at 570 K for time intervals ranging from 60 to 600 min. It is demonstrated that the diffusion of Al into Fe is smaller than the diffusion of Fe into Al for temperatures below 600 K. Sequential isochronous thermal anneals of 60 min were performed at temperatures ranging from 570 to 870 K, in order to study the stability of the formed phases. The stable Fe2Al5 intermetallic compound formed at 570 K decomposes at about 650 K, and the FeAl6 intermetallic compound appears at temperatures around 750 K.
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V.V. Nemoshkalenco, O.N. Rasumov, V.V. Gorskii: Phys. Stat. Solidi29, 45 (1968)
G.M. Hood: Philos. Mag.21, 305 (1970)
C.A. Stickels, R.H. Bush: Metall. Trans.2, 2031 (1971)
R.S. Preston: Metall. Trans.3, 1831 (1972)
J. Hirvonen, J. Räisänen: J. Appl. Phys.53, 3314 (1982)
K.K. Fung, C.Y. Young, Y.Q. Zhou, J.G. Zhao, W.S. Zhan, B.G. Shen: Phys. Rev. Lett.56, 2060 (1986)
A. Griger, V. Stefàniay, T. Turmezey: Z. Metallkde.77, 30 (1986)
R.A. Dunlap, K. Dini: Can. J. Phys.63, 1267 (1985)
R.A. Dunlap, K. Dini, G. Stroink, G.S. Collins, S. Jha: Hyper. Inter.28, 963 (1986)
R.W. Balluffi, J.M. Blakely: Thin Solid Films25, 399 (1975)
G. Ottaviani: J. Vac. Sci. Technol.16, 1112 (1979)
D. Gupta, P.S. Ho: Thin Solid Films72, 399 (1980)
K.L. Chopra, I. Kour:Thin Film Device Applications (Plenum, New York 1983)
K.N. Tu: Ann. Rev. Mater. Sci.15, 147 (1985)
S.R. Teixeira, P.H. Dionisio, E.F. da Silveira, F.L. Freire, Jr., W.H. Schreiner, I. J.R. Baumvol: Mat. Sci. Eng.96, 267 (1987)
S.R. Teixeira, P.H. Dionisio, M.A.Z. Vasconcellos, E.F. da Silveira, W.H. Schreiner, I.J.R. Baumvol: Mat. Soc. Eng.96, 279 (1987)
S.R. Teixeira, C.A. dos Santos, P.H. Dionisio, W.H. Schreiner, U.R. Baumvol: Mat. Sci. Eng.96, 285 (1987)
P.G.Shewman:Diffusion in Solids (McGraw-Hill, New York 1963)
A.B. Campbell, B.D. Startwell, P.B. Needham, Jr.: J. Appl. Phys.51, 283 (1980)
K. Hirano, R.P. Agarwala, M. Chen: Acta Metall.10, 857 (1962)
W. Alexander, L.M. Slifkin: Bull. Am. Phys. Soc.14, 388 (1969)
J. Miki, H. Warlimont: Z. Metallkde.59, 255 (1968)
J. Miki, H. Warlimont: Z. Metallkde.59, 408 (1968)
O. Kubaschevski:Iron Binary Phase Diagrams (Springer, Berlin, Heidelberg 1982)
H. Harada, S. Ishibe, R. Konishi, H. Sasakura: JPN. J. Appl. Phys.24, 1141 (1985)
G. Longworth, R. Jain: J. Phys. F8, 351 (1978)
Yu.S. Nechayev, Yu.A. Krupin, Yu.A. Mezhennyy, Yu.A. Pustov, L.N. Rastorguyev: Phys. Met. Metall.58, 115 (1984)
E.H. Hollingsworth, G.R. Frank, Jr., R.E. Willett: Metal. Trans. Soc. AIME224, 188 (1962)
R. Wang, J. Gui, S. Yao, Y. Cheng, G. Lu, M. Huang: Philos. Mag. B54, L33 (1986)
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Work supported in part by CNPq and FINEP
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Teixeira, S.R., Freire, F.L. & Baumvol, I.J.R. Interdiffusion, reaction, and stability in a thin film iron-aluminium bilayered system. Appl. Phys. A 48, 481–488 (1989). https://doi.org/10.1007/BF00619722
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DOI: https://doi.org/10.1007/BF00619722