Abstract
Polymeric styrene films with thicknesses ranging from about one nm up to a few μm have been deposited by means of a direct ion beam deposition (IBD) technique. The deposition energy, which can be chosen independently of the parameters which govern the plasma conditions, has been varied between few eV and 1000 eV. The correlation between the deposition parameters and the resulting film properties in terms of the electronic structure is discussed. The in situ characterization by electron spectroscopy has proved to be a very useful characterization method and ultraviolet photoelectron spectroscopy in particular revealed an extremely high sensitivity to structural differences in the deposited films. The polymeric films have also been characterized by scanning electron microscopy and optical spectroscopy. These techniques have also served to compare films prepared by the direct IBD technique with films obtained by standard rf plasma polymerization (RFPP) in a tubular reactor. Significant differences have been found which are dependent on the deposition parameters; these are discussed in detail.
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Department of Chemical Engineering, Beijing Institute of Technology, P.O. Box 327 Beijing, 100081 Beijing, P.R. China
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Ugolini, D., Tuilier, M.H., Eitle, J. et al. Direct ion beam deposition of polymeric styrene films and in situ characterization by electron spectroscopy. Appl. Phys. A 51, 526–536 (1990). https://doi.org/10.1007/BF00324737
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DOI: https://doi.org/10.1007/BF00324737