Abstract
Reliability and functionality of microsystems, i.e. of small scale integrated electronic, mechanical and optical components, largely depend on their mechanical and thermal constitution. Thermo-mechanical aspects of component and system reliability become more and more important with growing miniaturization as the local physical parameters and field quantities show an increase in sensitivity due to inhomogeneities in local stresses, strains and temperature fields. Since there is usually a lack of information about the local material parameters, a pure field simulation cannot, as a rule, solve the problem.
The state of the art of microsystem design more and more requires direct “coupling” between simulation tools (including e.g. FE modelling) and advanced physical experiments. The authors have combined various laser technique, scanning microscopy, and X-ray diffraction with numerical field simulation. The investigations have been directed towards current problems of mechanical and thermal reliability in electronic packaging, crack and fracture behaviour within the interconnected regions and life time estimation. Special problems of mechanical behaviour in solder joints are discussed taking into account local plasticity as well as creep effects.
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Dr. J. Auersperg, R. Döring, and Dr. R. Kühnert, Center of Micromechanics, Chemnitz, carried out some FEM calculations and the micromoiré experiments respectively.
This scientific work was supported by the Deutsche Forschungsgemeinschaft Bonn under Contract No. Mi 362/2-3 and Mi 362/3-1
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Michel, B., Schubert, A., Dudek, R. et al. Experimental and numerical investigations of thermo-mechanically stressed micro-components. Microsystem Technologies 1, 14–22 (1994). https://doi.org/10.1007/BF01367756
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DOI: https://doi.org/10.1007/BF01367756