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High aspect ratio fabrication method using O2 RIE and electroplating

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Abstract

A polyimide-based process for the fabrication of vertical structures with high aspect ratio has been developed. O2 reactive ion etching (O2 RIE) has been employed in the polyimide processing. Achieved etching characteristics of the O2 RIE system are: 4.0 μm/min etching rate, 15 aspect ratio, 75 μm etching depth. Polyimide has excellent chemical and thermal properties which makes it a good building material for micromachines. Polyimide could be also used as molds for electroplating. Electroplated copper structures were formed in the polyimide molds and metal gears were fabricated by these fabrication technologies. New possibilities for micromachining were opened by the use of O2 RIE and electroplating.

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Authors and Affiliations

  1. Basic Research Dept. Corporate Research Div., Olympus Optical Co., Ltd. 2-3 Kuboyama-cho, Hachioji-shi, 192, Tokyo, Japan

    K. Murakami

  2. Department of Mechatronics and Precision Engineering, Tohoku University, Aza Aoba, Aramaki, Aoba-ku, 980, Sendai, Japan

    K. Minami & M. Esashi

Authors
  1. K. Murakami
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  2. K. Minami
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  3. M. Esashi
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Additional information

This work was supported by Japanese ministry of Education Science and Culture under a grant-in-Aid No. 03102001.

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Murakami, K., Minami, K. & Esashi, M. High aspect ratio fabrication method using O2 RIE and electroplating. Microsystem Technologies 1, 137–142 (1995). https://doi.org/10.1007/BF01294805

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