Simulation of deposition and densification in an ion beam environment

https://doi.org/10.1016/0257-8972(92)90259-DGet rights and content

Abstract

We studied the role played by the incident ion beam in ion-beam-assisted deposition by first investigating the morphology of a vapor-deposited nickel film onto an Ni(100) surface using three-dimensional molecular dynamics. Ion-beam-induced void reduction was then modeled for the case of argon ions onto a germanium film using MARLOWE. The diffusion of residual vacancies and interstitials was taken into account. The nickel films exhibited columnar ribbon-like voids and an average packing fraction of 80%. Void volume loss as a function of depth, initial void volume and beam energy was determined. Void collapse occurred at depths well beyond the incident beam range; an increase in void size at shallow depths and higher beam energies was seen. The depth of the peak void loss rate was insensitive to beam energy.

References (9)

  • E.H. Hirsch et al.

    Thin Solid Films

    (1980)
  • C. Gilmore et al.

    Surf. Coat. Technol.

    (1992)
  • K.-H. Muller

    Phys. Rev. B

    (1987)
  • M.T. Robinson et al.

    Phys. Rev. B

    (1974)
There are more references available in the full text version of this article.

Cited by (0)

View full text