ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
The need for low-pressure molding of electronic assemblies and devices has long been realized by customers and plastic processors throughout the military, space, and commercial industry. Probably the single, greatest advance in this area to date has been the introduction of liquid resin molding or, as sometimes called, liquid transfer molding and liquid injection molding. This paper briefly discusses the studies being conducted in the area of material developments, applications, and tooling considerations and cites several case histories comparing the advantages of liquid resin molding vs powder molding. This paper also includes the relatively new efforts being investigated for economical mass production of solid state light-emitting diodes and solid state optical numerical readouts.
Additional Material:
4 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760100607
