ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Time/temperature cure profile diagrams of a nylon-epoxy adhesive and a rubber-modified epoxy based structural adhesive have been established from isothermal-cure time torsional braid analysis measurements. The characteristic zones of liquid, gel-rubber and glassy state behavior are noted on the diagrams. With the nylon-epoxy adhesive, the time/temperature cure profile is ill-defined since all the TBA data had to be obtained (due to the particular curing agent involved) at isothermal conditions above the glass temperature of the finally cured adhesive. In comparison, the rubber-modified epoxy system showed distinct zones reflecting the various rheological states traversed during the thermosetting process. The dynamic mechanical. (Rheovibron), morphology, and adhesive joint strength properties are examined as a function of cure cycle.
Additional Material:
9 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760191007
