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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 19 (1979), S. 810-814 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The effect of bonding temperature on the peel strength of adhesive joints, polyolefin/butyl rubber and polyolefin/ethylene-vinylacetate copolymer, has been investigated. The peel strength, measured at room temperature, undergoes a sharp transition from its low values to higher values as the bonding temperature is changed from below to above, the melting point of the substrate. This increase in peel strength is accompanied by changes in failure mode from the apparent interfacial failure to cohesive failure through the adhesives. Investigation of the interface using Fourier Transform Infrared Internal Reflection spectroscopy and interference microscopy indicates that the sharp increase in the peel strength at the melting temperature of substrate is associated with the presence of an interdiffused layer at the interface.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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