ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
The curing behavior of one-step phenolic molding compounds was studied using results of Rockwell hardness measurements at elevated temperatures with a cone indenter. The curing process was found to advance in a stepwise manner to the final stage of cure at a specific temperature. An explanation for this phenomenon has been attempted by suggesting the alternating occurrence of two types of curing reactions - propagation and crosslinking. After proceeding to some extent of cure, only the propagation reaction can occur through the migration of low molecular resin to the reactive sites of polymer chains. The propagation facilitates the subsequent crosslinking which drastically enhances the hardness of the resin. The results of electrical resistivity measurements and acetone extraction tests were also found to support the occurrence of above phenomenon.
Additional Material:
8 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760200906
