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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 26 (1986), S. 358-361 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: We report the use of microdielectrometry for monitoring the cure of the matrix resins in epoxy-glass and epoxy-graphite composites. The multi-ply laminates are cured in a press using ramped temperatures. The microdielectrometer sensor is embedded in a cavity made by cutting a hole in each of the inner plies. For a brominated-epoxy glass-reinforced prepreg ramped to final cure temperatures as high as 200°C and at pressures up to 60 psi, a reproducible pattern of cure events is observed beginning with the flow of resin onto the sensor electrodes and ending with the characteristic stabilizing of the loss factor late in cure. The apparent dielectric properties (permittivity and loss factor) show good reproducibility for identically prepared samples, but their characteristics differ from those observed in neat resin. A ten-fold increase in resin conductivity is noted when cures of glass-reinforced prepreg are compared to cures of neat resin flaked off the prepreg. Special techniques are required in sample preparation when monitoring the cure of prepregs containing conductive fibers such as graphite.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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