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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 127-133 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A method to obtain microscopic and macroscopic coatings with improved resistance to debonding is described. The procedure, based on polymer-metal complexes, involved the adsorption on inorganic substrates of a poly(vinyl alcohol)-copper II chelate that is also able to catalyze the polymerization of monomers or prepolymers with grafting. The molecular structure of the complex, its adsorption on inorganic surfaces, and the mechanism of the polymerization induced by the supported catalyst are summarized. Much emphasis is placed on application of this technology to the realization of encapsulated filler and pigment and of coatings with improved adherence and solvent resistance. In the field of composite materials, it is demonstrated from several examples that the encapsulation of the filler can be a way to block chemical interactions between filler and matrix, to promote filler dispersion, and to improve mechanical properties.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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