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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 31 (1991), S. 526-532 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This paper describes a process that facilitates fusion bonding of thermoplastic composite components without the need for complex fixtures and without disrupting the fiber alignment in the component laminates. The dual polymer bonding process, Thermabond, requires that an interlayer polymer be fused to the surface of each laminate prior to bonding. The characteristics of the interlayer polymer allow for joining of the components at a temperature below the softening/melting point of the reinforced polymer in the composite laminates. This leads to significant processing advantages without significant loss in mechanical performance. Discussions of resin compatibility, the effect of process conditions on mechanical performance, and the application of the APC-2/PEI Thermabond system to various structural components are included.
    Additional Material: 12 Ill.
    Type of Medium: Electronic Resource
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