ISSN:
0954-0911
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
During the last few years an increasing number of flip-chip (FC) interconnection technologies have emerged. While flip-chip assembly offers many advantages compared with conventional packaging techniques, several aspects prevent this technology from entering the high volume market. Among these are theavailability of bumped chips and the costs of the substrates, i.e., ceramic substrates withclosely matching coefficient of thermal expansion (CTE) to the chip, in order to maintain highreliability. Only recently, with the possibility of filling the gapbetween chip and organic substrate with an encapsulant, was the reliability of flip-chipsmounted on organic substrates significantly enhanced. This paperpresents two approaches to a fluxless process, one based on soldering techniques using Au-Snmetallurgy and the other on adhesive joining techniques. Soldering is performed with athermode and with a laser based system. For both of these FC-joining processes, alternativebump mettallurgies based on electroplated gold, electroplated gold-tin, mechanical gold andelectroless nickel gold bumps are applied.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/09540919610777627
