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Three-dimensional imaging of a silicon flip chip using the two-photon optical-beam induced current effect (2002)

Ramsay, E. ; Reid, D. T.

Woodbury, NY : American Institute of Physics (AIP)

Applied Physics Letters 81 (2002), S. 7-9

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ISSN: 1077-3118

Source: AIP Digital Archive

Topics: Physics

Notes: We describe two- and three-dimensional imaging of a flip-chip silicon integrated circuit using backside optical probing and femtosecond two-photon excitation at a laser wavelength of 1.275 μm. Using a ×50 microscope objective, we typically achieved micron resolutions or better in both lateral and axial directions. Using axial scanning and a peak-detection algorithm we have demonstrated optical depth profiling across components on the chip. © 2002 American Institute of Physics.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1063/1.1491301

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