Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
58 (1991), S. 2217-2219
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Laser cleaning with pulsed ultraviolet and infrared lasers is successfully employed to remove particulate contamination from silicon wafer surfaces and from delicate lithography membrane masks. Particulate material investigated include latex, alumina, silicon, and gold. Gold particles as small as 0.2 μm can be effectively removed. This new and highly efficient laser cleaning is achieved by choosing a pulsed laser with short pulse duration (without causing substrate damage), and a wavelength that is strongly absorbed by the surface; the removal efficiency is further enhanced by depositing a liquid film of thickness on the order of micron on the surface just before the pulsed laser irradiation.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.104931
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