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YAG laser direct writing of copper from copper formate films (1990)

Müller, Heinrich G.

Woodbury, NY : American Institute of Physics (AIP)

Applied Physics Letters 56 (1990), S. 904-906

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ISSN: 1077-3118

Source: AIP Digital Archive

Topics: Physics

Notes: Very thin copper lines for seeding of chemical copper deposition have been deposited by laser direct writing techniques, using water soluble precursor films from copper formate. Writing speeds of up to 50 mm/s could be reached. The deposition process has a strong influence on the substrate surface, thereby achieving a very stable film adhesion.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1063/1.102624

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