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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 449-452 (Mar. 2004), p. 849-852 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉 has been widely investigated for their intriguing physical and mechanical properties [1]. In the past decades, dense and pure polycrystalline Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉 has been fabricated by some techniques [1,2]. Studies on deformation and fracture behavior at elevated temperature showed that Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉 exhibited substantial plasticity with high strength [3]. It is pointed out that Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉 can be possibly used for some contact applications, such as bearings, for its relative high compression strength, self-lubricating and machinability [1]. In the present paper, fatigue crack-growth rates and Hertzian contact damage of Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉 were studied. Shielding ability of Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉 was investigated specially in the small crack region. Damage evolution and strength degradation under Hertzian contact were studied to reveal damage behavior and mechanisms in Ti〈sub〉3〈/sub〉SiC〈sub〉2〈/sub〉
    Type of Medium: Electronic Resource
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