ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Copper, Cu-2%Sn and Cu-4.5%Sn alloys have been deformed in plane straincompression at temperatures up to 700oC and the evolution of the microstructures and texturesdetermined by high resolution EBSD. The effect of the solute is to raise the temperature at whichdynamic recrystallization occurs and to significantly reduce the size of the dynamicallyrecrystallized grains. In all the materials, there is a small increase in the cube texture component ondynamic recrystallization. The boundary bulges which precede recrystallization are different in thecopper and Cu-Sn alloys, although in both materials there is evidence that local deformation in theboundary regions plays a significant role in dynamic recrystallization
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/17/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.558-559.449.pdf
