ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The paper reviews methods of hydrophobic wafer bonding. Hydrophobic surfaces areobtained by removing the oxide layer from the surfaces of crystalline silicon substrates. Bondingsuch surfaces causes the formation of a dislocation network in the interface. The structure of thedislocation network depends only on the misalignment (twist and tilt components). The differentdislocation structures are discussed.Because wafer bonding offers a method to the reproducible formation of such networks, differentapplications are possible
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/19/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.590.57.pdf
