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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 345-346 (Aug. 2007), p. 565-568 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: For steady-state deformation caused by grain-boundary diffusion and viscousgrain-boundary sliding, the creep rate of regular polyhedral grains is analyzed by theenergy-balance method. For the microstructure, the grain-grain interaction increases the degree ofsymmetry of diffusional field, resulting in a decrease of the effective diffusion distance. Meanwhile,the viscous grain-boundary sliding is found to decrease the creep rate. The present analysis revealsthat the grain-size exponent is dependent on the grain size and the grain-boundary viscosity: theexponent becomes unity for small grain sizes and/or high viscosity, while it is three for large grainsizes and/or low viscosity
    Type of Medium: Electronic Resource
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