ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
A viscoplastic constitutive model with void damage is developed to analyze themacroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGApackaging under cyclic thermal loading. The constitutive model is implemented into ABAQUSthrough its user defined material subroutine. Two-dimensional nonlinear finite element analysis of aceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation anddamage failure process of the lead-free solder joint under cyclic thermal loading. The damage modelis helpful for optimization and reliability of electronic package
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.44-46.77.pdf
