ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
a-CNx films were deposited onto silicon wafers at temperatures from RT up to 600 °C byusing pulsed KrF excimer laser deposition. The composition, morphology and microstructure of theCNx films were characterized by X-ray photoelectron spectrum (XPS), scanning electronmicroscopy (SEM) and Raman spectrum. The tribological performance of the films wasinvestigated using a ball-on-disk tribometer. With increasing the deposition temperature rangingfrom RT to 400 °C, the N content of films dropped from 36 at.% to 22 at.%, the ratio of N-sp3 Cbonds, hardness and friction coefficient of the film decreased. Further increase of depositiontemperature led to the lack of nitrogen and the increasing degree of order in ringed sp2 C=C bondsof the amorphous carbon film. The mechanical and tribological performances became worse. Thefilm deposited at 300°C showed a low friction coefficient of 0.11 and a preferable wear resistanceof 1.65×10–7 mm3 Nm–1 in humid air
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.47-50.549.pdf
