ISSN:
1662-9779
Quelle:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Thema:
Physik
Notizen:
Many process parameters are involved during the fabrication of Csf/Mg composites usingextrusion directly following vacuum infiltration. The selection of suitable process parameters isimportant for the successful fabrication of composites. This will require a continuous monitoring andcollecting system of process parameters. This paper describes how this is performed. The monitoringand collecting system is developed to monitor and control the forming process successfully. Thehardware was built with data acquisition (DAQ) card based on PCI and various sensors fortemperature, pressure, displacement. The industrial computer is used to process the data collectedfrom the sensors. The data acquisition card is the bridge between the computer and sensors. In order toreduce the signal noise from sensors, the hardware filter circuit is designed. The data acquisition cardcan not work by connecting the computer and sensors through it simply. It must be operated throughthe self-developed software. The data colletcing software is developed in this paper. It can realize theparameter monitoring and collecting easily by setting up the hardware through the user friendlyinterface. The curves of parameters can be displayed on the computer screen and the data can be savedinto the database for post-processing. The software also supplies the warning function. When theparameters (for example the temperature of mold) arrives the set value, the computer can sound a noteof warning to tell the worker to operate the press. It is demonstrated that the main parameters, such astemperature of mold and liquid metal, the loaded pressure and the displacement of punch, can bemonitored and collected in real-time by use of this system. This paper found the base for the furtherselection of optimized process parameters
Materialart:
Digitale Medien
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.141-143.85.pdf
