ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract A heat flow model is presented of the solidification process of a thin melt layer on a heat conducting substrate. The model is based on the two-dimensional heat conduction equation, which was solved numerically. The effect of coexisting regions of good and bad thermal contact between foil and substrate is considered. The numerical results for thermal parameters of the Al-Cu eutectic alloy show considerable deviations from one-dimensional solidification models. Except for drastic differences in the magnitude of the solidification rate near the foil-substrate interface, the solidification direction deviates from being perpendicular to the substrate and large lateral temperature gradients occur. Interruption of the thermal contact may lead to back-melting effects. A new quantity, the effective diffusion length, is introduced which allows some conclusions to be drawn concerning the behaviour of the frozen microstructure during subsequent cooling.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01058090
