ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
Chemical mechanical polishing (CMP) of platinum thin films was performed for theimprovement of surface morphology. Platinum thin films after CMP process with alumina slurryshowed the increase of surface morphology without a remarkable difference of the thermalcharacteristics of as-annealed platinum thin films. The power consumption of platinum thin filmsmicro-heater also became very low by improvement of surface morphology after CMP process. Thesimilar or improved electrical and thermal characteristics of platinum thin films for micro-heater ofsensor applications as well as evaluation possibility of sensing property by the improved surfacemorphology were obtained after CMP process
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.267.pdf