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  • Digitale Medien  (6)
  • 2005-2009
  • 1990-1994  (5)
  • 1920-1924
  • 1905-1909  (1)
  • Chemistry  (4)
  • Haemolytic uraemic syndrome  (2)
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  • Digitale Medien  (6)
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  • 1
    Digitale Medien
    Digitale Medien
    Prostacyclin in diarrhoea-associated haemolytic uraemic syndrome (1993)
    Springer
    Pediatric nephrology 7 (1993), S. 515-519 
    Details
    ISSN: 1432-198X
    Schlagwort(e): Haemolytic uraemic syndrome ; Prostacyclin
    Quelle: Springer Online Journal Archives 1860-2000
    Thema: Medizin
    Notizen: Abstract The role of prostacyclin (PGI2) in the pathogenesis of haemolytic uraemic syndrome (HUS) is controversial. In part, confusion has been caused by failure to distinguish between two main sub-types of the syndrome: extrinsic, diarrhoea-associated HUS (D+ HUS), usually caused by infection with verocytotoxin-producingEscherichia coli orShigella dysenteriae, and the heterogeneous group of non-prodromal forms where intrinsic factors predominate (D− HUS). This paper critically reviews data confined to D+ HUS. Two methods have been used to assess PGI2 synthesis; the generation of PGI2 from endothelium in the presence of HUS plasma in vitro and the measurement of stable metabolites in body fluids. No concensus could be reached with regard to the former. The reported increase of PGI2 stable metabolites in plasma may represent reduced clearance or increased carriage by plasma lipids. Apparent differences between studies of urinary excretion of PGI2 metabolites may reflect the way excretion was expressed. If the metabolite concentration is factored for urinary creatinine, it appears that renal excretion and thus renal synthesis of PGI2 is reduced. However, these are insufficient data on which to attribute the pathogenesis of D+ HUS to disordered PGI2 metabolism.
    Materialart: Digitale Medien
    URL: http://dx.doi.org/10.1007/BF00852530
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  • 2
    Digitale Medien
    Digitale Medien
    The expression of blood group P1 in post-enteropathic haemolytic uraemic syndrome (1990)
    Springer
    Pediatric nephrology 4 (1990), S. 59-61 
    Details
    ISSN: 1432-198X
    Schlagwort(e): Blood group P1 ; Haemolytic uraemic syndrome ; Verotoxin
    Quelle: Springer Online Journal Archives 1860-2000
    Thema: Medizin
    Notizen: Abstract Blood group P1 expression was scored by direct agglutination in 32 patients who had previously developed post-enteropathic haemolytic uraemic syndrome (HUS). Sixty-six children of similar ages undergoing venepuncture for other renal disorders acted as controls. The expression of P1 in controls was that expected from the normal caucasian population, 23% being negative. By contrast, there was an excess of HUS patients with weak or absent expression of P1 (χ2 for linear trend 5.45,P〈0.02), and this was particularly evident in those with a poor outcome. Verotoxin (VT), which is associated with HUS, requires the terminal disaccharide of the P1 antigen to bind to cells, and after internalization disrupts the transcription of ribonucleic acid. Mature erythrocytes do not synthesize protein and may be toxin resistant. We postulate that strong expression of P1 antigen may promote the binding of VT to red cells and thus reduce the dose to vulnerable nucleated cleated endothelial cells. P1 positivity may be protective, and P1 negativity a risk factor in HUS.
    Materialart: Digitale Medien
    URL: http://dx.doi.org/10.1007/BF00858441
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  • 3
    Digitale Medien
    Digitale Medien
    Experimental and numerical investigations of the vacuum-forming process (1992)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 1163-1173 
    Details
    ISSN: 0032-3888
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: This paper exmines the influence of process variables on final thickness distributions for vacuum-formed thermoplastic parts. The process variables investigated include evacuation rate, sheet surface temperature, mold temperature, and material slip over the mold surface. The experimental data presented include, in addition to thicknesses, sheet surface temperature obtained via infrared thermography. A finite element program to model the vacuum-forming process is discussed, and the wall thickness distribution predicted by this program for a vacuum-formed part is compared with the results of the experiments.
    Zusätzliches Material: 16 Ill.
    Materialart: Digitale Medien
    URL: http://dx.doi.org/10.1002/pen.760321613
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  • 4
    Digitale Medien
    Digitale Medien
    Thermomechanical properties of 1C molding compoundsPresented at the Annual Meeting of American Institute of Chemical Engineers in San Francisco, California on November 6, 1989. (1990)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 609-617 
    Details
    ISSN: 0032-3888
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: Eight commercial semiconductor grade epoxy compounds that are used to encapsulate 1C (integrated circuit) devices have been evaluated for their ability to minimize the development of thermal stresses which can cause failure during device temperature cycling. Thermal expansion, dynamic modulus and adhesion studies are used to describe the mechanical interaction between the plastic package and the silicon device it surrounds. A “figure of merit” is defined for the development of stress on the 1C device as it is cooled after the packaging process. The stress is shown to be proportional to the product of three terms: (αp-αs) Ep (Tanch-T) where αp and αs are the expansion coefficients for the plastic and silicon, respectively, Ep is the modulus of the epoxy and Tanch is the temperature at which the epoxy becomes anchored to the silicon device during transfer molding. In addition, the importance of good adhesion between the epoxy encapsulant and the silicon device to prevent package cracking has been demonstrated by finite element analysis and a novel adhesion test.
    Zusätzliches Material: 16 Ill.
    Materialart: Digitale Medien
    URL: http://dx.doi.org/10.1002/pen.760301008
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  • 5
    Digitale Medien
    Digitale Medien
    Eine neue massanalytische Schnellmethode zur Bestimmung von Niob bei Gegenwart von Tantal und ihre Anwendung zur Analyse von Niobmineralien (1909)
    Weinheim : Wiley-Blackwell
    Zeitschrift für anorganische Chemie 62 (1909), S. 383-394 
    Details
    ISSN: 0863-1778
    Schlagwort(e): Chemistry ; Inorganic Chemistry
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie
    Notizen: 1. Eine Kaliumsulfat-Schwefelsäurelösung von Niob und Tantal, zu welcher Bernsteinsäure gesetzt worden ist, kann sehr stark verdünnt und erhitzt werden, ohne dass eine unlösliche Verbindung eines dieser Elemente sich ausscheidet.
    Materialart: Digitale Medien
    URL: http://dx.doi.org/10.1002/zaac.19090620136
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  • 6
    Digitale Medien
    Digitale Medien
    Three-dimensional finite element simulation of thermoforming (1990)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 1314-1322 
    Details
    ISSN: 0032-3888
    Schlagwort(e): Chemistry ; Chemical Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: The development of a finite element program specifically designed to simulate thermoforming in complex three-dimensional geometries is described. The large strain finite element model developed for simulating thermoforming processes is based on a total Lagrangian formulation which results in a nonlinear system of equations that must be solved iteratively. The nonlinear material behavior and contact between the polymer and mold surf aces ieads to additional complications in the numerical solution of the thermoforming simulation problem. In an effort to verify the accuracy of the finite element model developed in this study, analyses are compared with measurements obtained from three-dimensional three-formed parts.
    Zusätzliches Material: 8 Ill.
    Materialart: Digitale Medien
    URL: http://dx.doi.org/10.1002/pen.760302009
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