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  • 1
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 57 (1990), S. 1499-1501 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In situ time-resolved reflectivity (TRR) measurements have been made on unpatterned 800 nm pure Al films located on top of different underlying layers (e.g., substrate, diffusion barrier, or oxide) under XeCl (λ=308 nm, pulse width 40 ns) excimer laser planarization conditions. The reflectivity change observed when using a HeNe (λ=632.8 nm) probe beam is assumed to indicate layer melting. Results show that Al melt durations increase with laser energy fluence, oxide thickness, and substrate temperature. In addition, under certain processing conditions Al areas with a thick underlying oxide remain molten for over 1000 ns while no Al melting is observed where it directly contacts the silicon substrate. This work explains why substrate heating during excimer laser planarization is necessary in order to completely fill high aspect ratio contact holes.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1435-1536
    Keywords: Rubber modification ; low crosslink density highT g epoxy ; toughening mechanisms ; double-notch four-point-bend ; fatigue fracture
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The fracture behavior of a core-shell rubber (CSR) modified cross-linkable epoxy thermoplastic (CET) system, which exhibits high rigidity, highT g, and low crosslink density characteristics, is examined. The toughening mechanisms in this modified CET system are found to be cavitation of the CSR particles, followed by formation of extended shear banding around the advancing crack. With an addition of only 5 wt.% CSR, the modified CET possesses a greater than five-fold increase in fracture toughness (G IC) as well as greatly improved fatigue crack propagation resistance properties, with respect to those of the neat resin equivalents. The fracture mechanisms observed under static loading and under fatigue cyclic loading are compared and discussed.
    Type of Medium: Electronic Resource
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