ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract Silicon nitride with thin sputter-deposited titanium and nickel films was joined to SUS304 stainless steel (18% Cr-8% Ni) using metallic buffers in a series of silicon nitride/nickel/ molybdenum/nickel/SUS304, and the joining strength and microstructures were investigated. Four-point bending tests showed fracture strength of the joints up to 169 MPa. Cracks were formed at the interface between the silicon nitride and its adjacent nickel buffer, and frequently extended into the silicon nitride. Microstructural analyses revealed that the silicon nitride reacted with the sputter-deposited titanium producing titanium nitride and isolated silicon atoms, and that silicon and titanium diffused into the nickel buffer. Calculations using a finite-element method indicated a marked reduction in thermal stress induced in the joined silicon nitride with increasing thickness of the molybdenum buffer. The strong interfacial bond inducing the fracture of the joined silicon nitride was interpreted in terms of a good interfacial reaction, the interdiffusions and the reduction of thermal stress being due to the insertion of the molybdenum buffer.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01107221
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