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  • 61.16.Di  (1)
  • 79.20  (1)
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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 10 (1976), S. 111-119 
    ISSN: 1432-0630
    Keywords: 79.20 ; 61.80
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract SEM signals were used to image ion-implanted surfaces and to quantitatively analyze implanted layers. Silicon was used as substrate material for implantation, but some measurements on GaAs are also reported. Various ion species were implanted and the dependence of the signals upon fluence was studied. Electron backscattering and absorbed current were found to be influenced by the radiation damage rather than by the species of implanted ions. The degree of damage could be characterized by absorbed current measurements. The ion fluence necessary to produce amorphous layers was determined for N, P, and As in Si using this technique. This fluence was found to correspond to an energy deposition of 2.8×1021 keV/cm3. For the detection of very small amounts of implanted ions by characteristic X-rays, the electron energy must be fitted to the penetration depth of the ions under conditions maintaining reasonable excitation cross sections. The lowest value of the normalized detectability obtained in our measurements was 2.5×1013 Ions/cm2 for 45 keV phosphorus.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Applied physics 32 (1983), S. 129-134 
    ISSN: 1432-0630
    Keywords: 61.80.Jh ; 61.16.Di ; 61.70.Tm
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Implantation into a confined surface area produces considerable radiation damage even outside the implanted area. The distance between the damage boundary and the implantation boundary can be determined by simultaneously recording the sample current and the characteristic x-ray signal in a scanning electron microscope. This method was applied to investigate the lateral extent of radiation damage in Si, GaAs, and GaP. Annealing studies were performed with Si. It was found that the lateral excess of damage over the implanted area can be more than 1 μm even if the projected range is less than 0.1 μm. In Si, this marginal damage, except for oxidation induced stacking faults, can be annealed under the same conditions as necessary for the annealing of the implanted zone itself. Experimental support is given to the prediction of Campisano and Barbarino [1] that within the implanted region the recrystallization rate of the amorphous layer reaches a maximum within a range of concentration near the maximal solid solubility.
    Type of Medium: Electronic Resource
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