ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
The high-temperature electrical conductivity and thermal decomposition characteristics of Sylgard® 184 with and without hollow microspheres of glass, silica, and ceramic have been determined to 600 to 700°C in air and nitrogen environments. The materials are silicone-based dielectrics and are used as electronic encapsulants. Results show that a peak in the conductivity temperature dependence at ∼300°C results principally from volatilization of [Si(CH3)2O]n with some evolution of water, that oxygen accelerates decomposition, and that the microspheres may help form a network of interconnected conductive pathways in the residual material. There is a good correlation between thermal stability and temperature-dependent electrical properties.
Additional Material:
10 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760240608
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