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  • 1
    Electronic Resource
    Electronic Resource
    Assortative mating for IQ and personality due to propinquity and personal preference (1988)
    Springer
    Behavior genetics 18 (1988), S. 339-345 
    Details
    ISSN: 1573-3297
    Keywords: assortative mating ; IQ ; Eysenck's Personality Inventory (EPI) ; extraversion ; neuroticism
    Source: Springer Online Journal Archives 1860-2000
    Topics: Biology , Psychology
    Notes: Abstract The role of personal preference as an active process in mate selection is contrasted with the more passive results of limitations of available mates due to social, educational, and geographical propinquity. The role of personal preference estimated after removing the effects of variables representing propinquity was still significant for IQ and Eysenck's extraversion-introversion and inconsistency (lie) scales, even though small.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01260934
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    Spouse similarity for IQ and personality and convergence (1989)
    Springer
    Behavior genetics 19 (1989), S. 223-227 
    Details
    ISSN: 1573-3297
    Keywords: assortative mating ; homogamy ; convergence
    Source: Springer Online Journal Archives 1860-2000
    Topics: Biology , Psychology
    Notes: Abstract A similar pattern of spousal association for IQ scores and personality traits was found in two British samples from Oxford and Cambridge. There was no indirect evidence from either sample to suggest that convergence occurred during marriage. All observed assortative mating might well be due to initial assortment.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01065906
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    Experimental and numerical investigations of the vacuum-forming process (1992)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 1163-1173 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This paper exmines the influence of process variables on final thickness distributions for vacuum-formed thermoplastic parts. The process variables investigated include evacuation rate, sheet surface temperature, mold temperature, and material slip over the mold surface. The experimental data presented include, in addition to thicknesses, sheet surface temperature obtained via infrared thermography. A finite element program to model the vacuum-forming process is discussed, and the wall thickness distribution predicted by this program for a vacuum-formed part is compared with the results of the experiments.
    Additional Material: 16 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760321613
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    Thermomechanical properties of 1C molding compoundsPresented at the Annual Meeting of American Institute of Chemical Engineers in San Francisco, California on November 6, 1989. (1990)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 609-617 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Eight commercial semiconductor grade epoxy compounds that are used to encapsulate 1C (integrated circuit) devices have been evaluated for their ability to minimize the development of thermal stresses which can cause failure during device temperature cycling. Thermal expansion, dynamic modulus and adhesion studies are used to describe the mechanical interaction between the plastic package and the silicon device it surrounds. A “figure of merit” is defined for the development of stress on the 1C device as it is cooled after the packaging process. The stress is shown to be proportional to the product of three terms: (αp-αs) Ep (Tanch-T) where αp and αs are the expansion coefficients for the plastic and silicon, respectively, Ep is the modulus of the epoxy and Tanch is the temperature at which the epoxy becomes anchored to the silicon device during transfer molding. In addition, the importance of good adhesion between the epoxy encapsulant and the silicon device to prevent package cracking has been demonstrated by finite element analysis and a novel adhesion test.
    Additional Material: 16 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760301008
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    Paper (German National Licenses)
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  • 5
    Electronic Resource
    Electronic Resource
    The effects of cure temperature on the thermomechanical properties of UV curable coatings (1989)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1165-1168 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A method is presented to study the mechanical behavior of soft, UV curable coating material as a function of temperature of the prepolymer at cure. For such materials, the crosslink density (hence, equilibrium modulus) is found to decrease with increasing cure temperature. The three primary coatings are: a polyurethane acrylate with a nominal equilibrium tensile modulus of 200 psi, a polyurethane acrylate with a nominal equilibrium modulus of 1200 psi, and a non-urethane acrylate with a nominal equilibrium tensile modulus of 60 psi.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760291704
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    Paper (German National Licenses)
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  • 6
    Electronic Resource
    Electronic Resource
    Time temperature dependence of dual coated lightguide pullout measurements (1989)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1169-1171 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The strength of the bond between primary coating and glass for a dual coated lightguide may be judged by fixing the coating to a substrate and pulling the glass out. The values obtained from such measurements are shown to exhibit a temperature and rate dependence similar to the mechanical properties of the primary coating for a given coating system. Here we combined temperature and rate data for a universal description of the coating to glass adhesion for a dual coating system.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760291705
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    Paper (German National Licenses)
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  • 7
    Electronic Resource
    Electronic Resource
    Mechanical relaxation of flame retardant polycarbonate using the cole-cole method (1985)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 25 (1985), S. 105-112 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The frequency dependence of the complex-shear modulus of a nonbrominated flame-retardant polycarbonate has been successfully represented from 1 hertz (hz) to 1 gigahertz (ghz) at 190°C using a mechanical analog of the Cole-Cole dielectric analysis. Two sets of retardation times were required centered about 74 msec and 16 μsec. The β value for the short time response was 0.83 and for the longer time response was 0.58. The values of JoN determined from the common point at which the terminal-zone arc and the transition-zone arc touch the Jc″ = 0 axis yields an entanglement molecular weight, Me, of 1470 g/mole.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760250208
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    Paper (German National Licenses)
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  • 8
    Electronic Resource
    Electronic Resource
    Three-dimensional finite element simulation of thermoforming (1990)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 1314-1322 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The development of a finite element program specifically designed to simulate thermoforming in complex three-dimensional geometries is described. The large strain finite element model developed for simulating thermoforming processes is based on a total Lagrangian formulation which results in a nonlinear system of equations that must be solved iteratively. The nonlinear material behavior and contact between the polymer and mold surf aces ieads to additional complications in the numerical solution of the thermoforming simulation problem. In an effort to verify the accuracy of the finite element model developed in this study, analyses are compared with measurements obtained from three-dimensional three-formed parts.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760302009
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    Paper (German National Licenses)
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