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  • 1
    ISSN: 0947-5117
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Description / Table of Contents: Eine elektrochemische, topographische und analytische Untersuchung über das Verhalten des Metal I-Nichtmetall-Glases (Fe, Cr)80 (P, C, Si)20 in wäßrigen Lösungen, die Chlorid- oder Sulfationen enthaltenDas metallische Glas (Fe, Cr)80 (P, C, Si)20 wurde in wäßrigen Lösungen mit hohen Gehalten an NaCl (3 M) untersucht. Zum Vergleich wurden entsprechende Lösungen mit Zugabe von 1,5 M Na2SO4 verwendet. Der pH-Wert der Lösungen überstreicht die Bereiche von stark sauer (0,5 M H2SO4) bis stark alkalisch (1 M NaOH). Die korrosiven Eigenschaften des metallischen Glases wurden bei 25°C and 50°C bestimmt.Unter Verwendung elektrochemischer Methoden konnte das Langzeitverhalten bezüglich der Korrosion abgeschätzt werden. Die Grundlage bildeten Stromdichte-Potentialkurven, die potentiodynamisch ermittelt wurden. Ausgehend von diesen Kurven war es möglich, mit der Methode der Konstruktion von Tafelgeraden bzw. der Bestimmung des Polarisationswiderstandes die jährliche Abtragsrate für das metallische Glas zu bestimmen. Als Elektroden wurden bei den elektrochemischen Untersuchungen eingebettete Fasern des metallischen Glases eingesetzt. Die Messung erfolgte unter rotierenden Bedingungen.Die bestimmten jährlichen Abtragswerte erstrecken sich über mehrere Dimensionen. Der höchste Werte (44 mm/a) wurde in der stark sauren Lösung mit hohem NaCl-Gehalt bei 50°C ermittelt. Den geringsten Materialverlust erhält man in alkalischer Lösung bei Raumtemperatur. Das Verhalten im alkalischen Medium ist unabhängig von der Art des zugegebenen Salzes (NaCl oder Na2SO4).Die elektrochemisch behandelten Fasern wurden durch REM-und EDX-Untersuchungen charakterisiert.
    Notes: The metal-metalloid glass (Fe, Cr)80 (P, C, Si)20 was investigated in aqueous solutions which contain high quantities of NaCl (3 M). For comparison we use a solution with 1.5 M Na2SO4. These solutions reach from the strong acid area (0.5 M H2SO4) to the strong alkaline region (1 M NaOH). The corrosive properties of the metal-metalloid glass were determined at 25°C and 5°C.By the use of electrochemical methods it was possible to estimate the long time corrosive properties. Therefore current-potential-curves were determined by the use of a potentiodynamic technique. Starting from this curves it was possible by use of the tafel plot method or the determination of the polarisation resistance to. calculate an annual pull down of the metallic glass. For these electrochemical experiments we used the glass ribbons as electrodes and we measured under rotating conditions.The determined values of the annual pull down vary in a large region. The highest rate (44 mm/a) was calculated for an acid chloride containing solution at a temperature of 50°C. The lowest pull down rate (≈ 0.3 μm/a) is obtained in the alkaline solution at room temperature. In the alkaline area there is no difference between the addition of NaCl or Na2SO4.The treated glass fibres were characterised by the use of Scanning Electron Microscopy (SEM) and EDX-Analysis.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Applied Organometallic Chemistry 11 (1997), S. 237-247 
    ISSN: 0268-2605
    Keywords: Rochow reaction ; copper silicides ; η-Cu3Si ; promoters ; scanning electron microscopy (SEM) ; energy-dispersive X-ray spectroscopy (EDX) ; scanning Auger microscopy (SAM) ; Auger electron spectroscopy (AES) ; Chemistry ; Industrial Chemistry and Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Appropriate Rochow contact masses have been investigated by the spatial resolution techniques SEM-EDX and SAM-AES. The results gave evidence of the existence and the catalytic action of (X-ray)-amorphous copper-silicon (Cu-Si) surface species, i.e. extremely highly dispersed particles or two-dimensional species. The well-known Rochow promoter zinc seems to act as a moderator rather than as a real accelerator. It ensures a stable rate for the reaction by neutralizing the detrimental action of silicon impurities. The silicon impurities make the whole of the silicon surface reactive and in this way cause a general blockade of the silicon surface by inactive copper species. Zinc localizes the reaction. The silicon surface remains partly free, and active Cu-Si surface species can be formed by lateral diffusion of copper onto the silicon surface that is still free. © 1997 by John Wiley & Sons, Ltd.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Applied Organometallic Chemistry 12 (1998), S. 257-264 
    ISSN: 0268-2605
    Keywords: Rochow reaction ; cesium chloride ; rubidium chloride ; silicon impurities ; action of promoters ; scanning electron microscopy (SEM) ; energy-dispersive X-ray spectroscopy (EDX) ; Chemistry ; Industrial Chemistry and Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Cesium chloride- and rubidium chloride-promoted Rochow contact masses based on both technical-grade and highly pure silicon have been investigated in the Rochow reaction and by REM/EDX surface analysis. The alkali-salt promoters seem to act analogously to the well-known zinc promoter, by localizing the reaction to distinct reactive areas and keeping free the surface area for the reaction, probably for the formation of catalytically active Cu-Si surface species. The alkali salts exhibited their promoting action only in combination with the impurities within the technical-grade silicon. Otherwise, they acted as blocking poisons. The promoter action of alkali chlorides in contact masses based on technical-grade silicon is possibly connected with the formation of salt melts, containing alkali chlorides and impurities. These melts, analogously to zinc chloride, could dissolve oxidic impurities from the silicon surface which otherwise would enhance the blocking of potentially active surface by extensive copper deposition. © 1998 John Wiley & Sons, Ltd.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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