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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Plasma chemistry and plasma processing 4 (1984), S. 107-118 
    ISSN: 1572-8986
    Keywords: Negative ions ; positive ions ; etching plasmas ; SF6 ; O2
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Technology
    Notes: Abstract Positive and negative ions of Ar/SF6 and Ar/SF6/O2 plasmas (etching plasmas) and of Ar/O2 plasmas (cleaning plasmas) in Pyrex tubes have been investigated using a mass spectrometer-wall probe diagnostic technique. The measurement of negative ions proved to be a very sensitive method for the detection of wall material. In etching plasmas with small admixtures of SF6, oxygen was found as the only representative of wall material. At larger amounts of SF6, silicon could be detected. In cleaning plasmas with small admixtures of O2 applied to a previously etched Pyrex surface, fluorine was found, indicating the reversal of fluoridation by oxygenation.
    Type of Medium: Electronic Resource
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