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  • 1
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 46 (1992), S. 1417-1427 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The effect of welding pressure and surface contaminants on butt fusion in a commercial polyethylene gas pipe was studied by measuring the slow crack growth resistance of the joint. Two weld pressures, 1.61 and 0.31 MPa, were used. The contaminants Vaseline, graphite, and Teflon were coated on the surface. It was found that the high pressure produced a weld with much better slow crack growth resistance than that by low pressure. At high weld pressure, Vaseline and graphite showed a negligible effect on weld quality. Teflon greatly reduced the lifetime, especially at low weld pressure. Test results showed that sufficient pressure was necessary to squeeze out the thin skin layer that occurs at the weld interface, along with any contaminants. The butt fusion joints were always much weaker than the reference pipe. This result was attributed to the difference in both cooling rate and molecular orientation between the pipe and weld. © 1992 John Wiley & Sons, Inc.
    Additional Material: 14 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 33 (1995), S. 153-157 
    ISSN: 0887-6266
    Keywords: γ-irradiation ; polyethylene ; slow fracture ; dosage ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: HDPE was γ-irradiated at room temperature. The resistance to slow crack growth (SCG) was measured in single edge notched tensile specimens under constant load as a function of the dose. The resistance to SCG initially decreased to a minimum value at a dose between 0.05 and 0.10 Mrd. The minimum value was 45% less than for the undosed state. For doses greater than 0.10 Mrd, the resistance to SCG increased up to a dose of 50 Mrd, where its value had increased by a factor of 102. The gel point occurred at 1-3 Mrd. MI and the crack opening displacement exhibited maximum values at a dose of 0.1 Mrd. The behaviors of SCG, MI and crack opening displacement were consistent with the explanation that chain scission dominated for doses less than 0.1 Mrd, and cross-linking dominated at the higher doses. For doses beyond 50 Mrd, the resin became so brittle that it cracked during the loading of the specimen. Beyond the gel point the density increased from 0.9694 to 0.9716 g/cm3 at a dose of 160 Mrd. ©1995 John Wiley & Sons, Inc.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 30 (1992), S. 1207-1214 
    ISSN: 0887-6266
    Keywords: crack growth in ethylene-octene copolymer related to thermal history and morphology ; copolymer, ethylene-octene, effect of thermal history and morphology on crack growth in ; annealing and crack growth in ethylene-octene copolymer ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: The slow crack growth resistance was measured in an ethylene-octene copolymer as a function of the morphological changes produced by varying the thermal history. Morphology was varied by annealing the quenched state at temperatures between 86°C and the melting point. The slow crack growth behavior was measured by the lifetime of a notched tensile specimen under a constant load. In general, the lifetime exhibited a maximum at a critical value of the annealing temperature. This critical annealing temperature decreased with a decrease in the temperature at which the lifetime was measured. The former result is understandable in terms of the increase in crystal strength as the annealing temperature is increased and the decrease in the number of tie molecules when more material is melted as the annealing temperature increases. The latter result depends on the relationship between crystal size and the effect of testing temperature. Differential scanning calorimetry data played a key part in analyzing the results. © 1992 John Wiley & Sons, Inc.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part B: Polymer Physics 30 (1992), S. 899-906 
    ISSN: 0887-6266
    Keywords: crack growth in ethylene-hexene copolymer ; copolymer, ethylene-hexene, annealing and slow crack growth in ; annealing and crack growth in ethylene-hexene copolymer ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: A quenched ethylene-hexene copolymer was annealed in the temperature range of 86 to 127°C. The morphological changes were monitored by differential scanning calorimetry (DSC) and density. The slow crack growth resistance tested at 80°C was a maximum at an annealing temperature of 113°C and a minimum of 123°C. The lifetimes can be varied by more than a factor of 20 depending on the thermal treatment. The increase in slow crack growth resistance between 86 and 113°C is attributed to an increase in the strength of the crystals by becoming more perfect and to the conversion of loose tie molecules into taut tie molecules. The decrease in strength between 113 and 123°C is attributed to the decrease in tie molecules when a large fraction of the as-quenched crystals begin to melt.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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