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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 2535-2541 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Mesa etched transmission line model (TLM) test structures with different contact lengths have been fabricated on heavily boron doped polycrystalline diamond films. The behavior of the contact and contact end resistance measurements can be fully explained using the TLM. No influence of the grain size on the contact resistivity has been observed. High surface boron doping concentrations led to low contact resistivities, in agreement with numerical calculations. Annealing of Al/Si–diamond contacts at 450 °C in N2 leads to lower contact resistivities due the formation of SiC at the metal–diamond interface. The temperature dependence of the specific contact resistivity can be described well with a tunneling model before annealing. After annealing no useful fit is possible, indicative of the fact that the SiC interface layer acts as defect layer. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 64 (1994), S. 595-597 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Temperature-dependent conductivity and Hall measurements have been carried out on heavily in situ B-doped polycrystalline diamond films in a temperature range from ∼100 to 750 K. The slope of the conductivity is clearly non-Arrhenius leading to a pronounced tail at low temperatures. Carrier transport at low temperatures is dominated by variable range hopping. The activation energy decreases with increasing doping concentration and the most heavily doped diamond films show metallic behavior above room temperature. Hole carrier concentrations up to 1.8×1021 cm−3 were measured in agreement with secondary-ion-mass spectroscopy investigations.
    Type of Medium: Electronic Resource
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  • 3
    ISSN: 1573-482X
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract We report the growth of GaN and AlGaN films on GaAs (0 0 1) substrates in the temperature range 400–800 °C by metalorganic molecular beam epitaxy. An r.f. plasma nitrogen source was used in conjunction with triethylgallium and ethyl-dimethylamine-alane group III sources. Growth was initiated using either a low temperature AlN buffer layer or a graded arsenide-nitride buffer layer. The growth was monitored in real time using in-situ laser reflectometry. The temperature dependence of growth rates for the nitride layers are compared with their arsenide analogs. The relative growth rate of gallium nitride/gallium arsenide from triethylgallium was found to be in the range 54–60%, the Ga incorporation rates are closely comparable when the higher density of GaN is taken into account. The range of growth temperatures for gallium nitride extends to higher temperatures compared with gallium arsenide probably due to lower evaporation rates of Ga bound to the nitride surface. Reflection anisotropy spectra indicate that atomic nitrogen readily reacts with the GaAs (0 0 1)-c (4 × 4) As-stabilized surface at temperatures as low as 400 °C but without the gross faceting that has been observed at higher temperatures.
    Type of Medium: Electronic Resource
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