Library

feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 4444-4446 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The stability of an amorphous GexSi1−xO2 in contact with an epitaxial (100)GexSi1−x layer obtained by partially oxidizing an epitaxial GexSi1−x layer on a (100)Si substrate in a wet ambient at 700 °C is investigated for x=0.28 and 0.36 upon annealing in vacuum at 900 °C for 3 h, aging in air at room temperature for 5 months, and immersion in water. After annealing at 900 °C, the oxide remains amorphous and the amount of GeO2 in the oxide stays constant, but some small crystalline precipitates with a lattice constant similar to that of the underlying GeSi layer emerge in the oxide very near the interface for both x. Similar precipitates are also observed after aging for both x. The appearance of these precipitates can be explained by the thermodynamic instability of GexSi1−xO2 in contact with GexSi1−x. In water at RT, 90% of GeO2 in the oxide is dissolved for x=0.36, while the oxide remains conserved for x=0.28.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 5212-5216 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Several etchants have been applied to polar (111)Cd and (111)Te surfaces of CdTe. Induced surface layers were analyzed by x-ray photoelectron spectroscopy and grazing-incidence x-ray diffraction for studying compositions, chemical states, and crystalline phases of respective layers. A bromine/methanol etch led to a layer composed of mainly tellurium oxides on both (111) surfaces. Oxidation depth, however, was larger at the (111)Te side. Etching with HCl subsequently removed the oxides. A film made of crystalline tellurium was, however, produced with the thickness being larger on the (111)Te surface than on the other surface. A fairly thick layer consisting of TeO2 and crystalline Te for etching with N solution (H2O2:H2O:HF=2:2:3 v/v), formed on both surfaces with the cadmium having been severely depleted, especially on the (111)Te surface.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 70 (1991), S. 1369-1373 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have studied sputter-deposited Ta, Ta36Si14, and Ta36Si14N50 thin films as diffusion barriers between Cu overlayers and Si substrates. Electrical measurements on Si n+p shallow junction diodes demonstrate that a 180-nm-thick Ta film is not an effective diffusion barrier. For the standard test of 30-min annealing in vacuum applied in the present study, the Ta barrier fails after annealing at 500 °C. An amorphous Ta74Si26 thin film improves the performance by raising the failure temperature of a 〈Si〉/Ta74Si26(100 nm)/Cu(500 nm) metallization to 650 °C. Unparalled results are obtained with an amorphous ternary Ta36Si14N50 thin film in the Si/Ta36Si14N50(120 nm)/Cu(500 nm) and in the Si/TiSi2(30 nm)/Ta36SiN50(80 nm)/Cu(500 nm) metallization that break down only after annealing at 900 °C. The failure is induced by a premature crystallization of the Ta36Si14N50 alloy (whose crystallization temperature exceeds 1000 °C) when in contact with copper.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 7814-7819 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Iron containing diamond-like amorphous carbon (a-C:Fe) films were deposited by filtered cathodic vacuum arc technique. The influences of Fe content and substrate bias on the surface energy of the films were investigated. The surface energy of a-C:Fe films was determined by the contact angle measurement. Atomic force microscopy, Raman spectroscopy, and x-ray induced photoelectron spectroscopy were employed to analyze the origin of the variation of surface energy with various Fe content and substrate bias. It is found that the contact angle for water increases significantly after incorporating Fe into the films and the films become hydrophobic. The roughness of these films has no effect on the contact angle. The surface energy is reduced from 42.8 to 25 dyne/cm after incorporating Fe into the a-C film (10% Fe in the target), which is due to the reduction of both dispersive and polar component. The reduction in dispersive component is ascribed to the decrease of atomic density of the a-C:Fe films due to the increase in sp2 bonded carbon. When sp2 content increases to some extent, the atomic density remains constant and hence dispersive component does not change. The absorption of oxygen on the surface plays an important role in the reduction of the polar component for the a-C:Fe films. It is proposed that such network as (Cn–O–Fe)–O–(Fe–O–Cn) may be formed and responsible for the reduction of polar component. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 7373-7381 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Pt/Ge/Au trilayers of various Pt:Ge compositions, overlaid with a Ta-Si-N barrier layer and an Au metallization layer, are investigated as ohmic contacts to n-type GaAs. After annealing in flowing argon at 450 °C for 15 min, a contact resistivity of 3.7×10−6 Ω cm2 is obtained for the sample of atomic ratio Pt/Ge=1. The contact resistivity of this sample degrades only slightly to 5.0×10−6 Ω cm2 upon aging at 450 °C for 60 h, while the surface stays smooth. Contact resistivities of samples with other Pt/Ge atomic ratios are in the range of 10−5–10−4 Ω cm2. To understand this electrical behavior, the contacts are characterized by backscattering spectrometry, x-ray diffraction, and transmission electron microscopy in conjunction with energy-dispersive analysis of x rays. The reaction products vary with the Pt:Ge compositions due to the difference of the chemical reactivity between Pt, Ge, and GaAs. The formation and distribution of a ternary PtGe:As phase are the determining factors for the contact resistivity. The outstanding thermal stability of the contact is due to the Ta-Si-N barrier layer which closes the GaAs-trilayer system and protects their chemical equilibria from being disrupted by an inflow of Au from the metallization layer. Without the barrier layer, the morphology of the contact degrades badly at 450 °C after 20 h or less.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 76 (1994), S. 2169-2175 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The reaction between a sputter-deposited Ta film (320 nm thick) and a single crystalline (001) β-SiC substrate induced by vacuum annealing at temperatures of 600–1200 °C for 1 h (30 min at 1100 °C) is investigated by 3 MeV He++ backscattering spectrometry, x-ray diffraction, secondary ion mass spectrometry, and transmission and scanning electron microscopies. No significant reaction is observed at 800 °C or at lower temperatures. At 900 °C, the main product phases are Ta2C and carbon-stabilized Ta5Si3. A minor amount of unreacted Ta is also present. After annealing at 1000 °C, all the tantalum has reacted; the reaction zone possesses a multilayered structure of β-SiC/TaC/carbon-stabilized Ta5Si3/α-Ta5Si3/Ta2C. The diffusion path at 1000 °C is plotted on the isothermal section of the Ta-Si-C phase diagram. At 1100 °C, the reacted layer has an interface with the SiC substrate that is still quite flat but has a rough surface due to the formation of macroscopic voids within the reacted layer. The equilibrium products predicted by the phase diagram are TaC and TaSi2. This final state is reached by annealing at 1200 °C for 1 h. At that point, the reacted layer has a laterally very uneven structure and morphology.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 897-901 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thermal reactions of Re thin films in contact with single crystalline (001) β-SiC at temperatures between 700 and 1100 °C for 30 min are investigated by MeV He++ backscattering spectrometry, x-ray diffraction, secondary ion mass spectrometry, and transmission electron microscopy (plan-view and cross-sectional). No reaction between Re and SiC is observed for any annealing conditions. The average grain size of the as-deposited Re film is 220 nm and increases to 280 nm after annealing at 1100 °C for 30 min. A strong {0001}Re fiber texture is also observed after annealing. The chemical stability of Re thin films on SiC is consistent with the earlier study of solid-phase stability in the ternary Re-Si-C system which shows that Re and its silicides have tie lines with SiC at 1600 °C. It also coincides with calculations of the free energy of reaction from assessed thermodynamic data for rhenium silicides and SiC. The implications of this Re stability with SiC for applications of Re as a metal for electrical contact to SiC-based devices are discussed.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 54 (1989), S. 1025-1027 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Infrared photodiodes fabricated with HgCdTe epilayers grown on GaAs substrates by molecular beam epitaxy (MBE) are reported here for the first time. Growth was carried out on the (211)B orientation of GaAs, and the as-grown epilayer (x=0.24) was p type. The n-p junction was formed by Be ion implantation, the resistance-area product (R0 A) at zero bias was 1.4×103 Ω cm2 , the wavelength cutoff was 8.0 μm, and the quantum efficiency was 22%; all were measured at 77 K. We show that in the diffusion regime diodes fabricated with MBE HgCdTe/GaAs have comparable R0 A product values to those made with HgCdTe grown by bulk techniques. This result discloses new possibilities for advanced monolithic HgCdTe devices based on GaAs integrated circuit technology.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 85 (1999), S. 3339-3344 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: P-Si(100) and n-Si(100) substrates had quite different responses to the same process parameters used in the modified four-step diamond growth method, i.e., pretreatment, heating, bias enhanced nucleation (BEN) and bias texture growth (BTG), which has been developed to grow textured diamond films by hot filament chemical vapor deposition. At the pretreatment step, a bright blue plasma discharge induced the formation of damaged voids randomly distributed on the surfaces of p-Si(100) and n-Si(100). The damaged voids on p-Si(100) are several microns in size and 3 μm in depth. In contrast, the size and depth of the damaged voids on n-Si(100) are in nanometer scale, approximately two orders of magnitude lower than those on p-Si(100). At the BEN step, carburization occurred along with the possibility of diamond nucleation. Unfacet nuclei of micron scale distributed around the edge of damaged voids all over the p-Si(100) substrate. In contrast, a great number of small nuclei of nanometer scale spread and covered all the damaged voids around the outer edge of the n-Si(100) substrate. The continuous textured diamond film grown on p-Si(100) had better diamond quality than that on n-Si(100) at the BTG step. The textured diamond film on p-Si(100) was flat, however, that on n-Si(100) was under stress in convex shape. Ion bombardment at the BTG step resulted in the enhancement of the growth of textured diamond and in the degradation of diamond quality through the formation of amorphous carbon. P-Si(100) is considered better than n-Si(100) to be the substrate for textured diamond deposition. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 63 (1993), S. 1405-1407 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: An epitaxial Ge layer is grown by solid-phase epitaxy on an underlying Ge0.82Si0.18 seeding layer with a Ge-SiO2 matrix positioned between them. To this end, a (100)Si substrate with a Ge0.82Si0.18 epilayer is first oxidized in a wet ambient at 700 °C for 30 min to transform an upper fraction of the epilayer to amorphous Ge0.82Si0.18O2. A second annealing step (700 °C/16 h) in a 95% N2+5% H2 ambient (forming gas) reduces the GeO2 to Ge which grows epitaxially by solid-phase reaction on the remaining Ge0.82Si0.18 layer. A self-induced intermediate layer of epitaxial Ge with SiO2 inclusions restricts the propagation of dislocations, resulting in a crystalline perfection of the overlying Ge epilayer superior to that of the Ge0.82Si0.18 template.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...